| 摘要 |
PROBLEM TO BE SOLVED: To reduce the possibility that a filler in a mold resin adheres to exposed surfaces of electronic components as foreign objects in an electronic device where one part of a semiconductor chip is sealed by the mold resin and the other part is exposed from the mold resin.SOLUTION: A manufacturing method of an electronic device includes: a cover step which at least parts of exposed surfaces 14, 112, 122, 152, 162 in a semiconductor chip 10 are coated by a filler-less resin 70 which does not container a filler; a mold step where the semiconductor chip 10 is installed in a mold 100 and a mold resin 20 is molded so that sealed surfaces 13, 111, 121, 151, 161 in the semiconductor chip 10 are sealed by the mold resin 20; and a laser step where a laser beam L is applied to the filler-less resin 70 thereby removing the filler-less resin 70 and exposing the exposed surfaces. |
