| 摘要 |
PROBLEM TO BE SOLVED: To provide a peeling composition capable of reducing generation of a liquid trace residue on a surface of a substrate after peeling a support plate.SOLUTION: A peeling composition includes a solvent for dissolving an adhesive bonding a support plate to a substrate so as to peel the substrate from the support plate, and a content of high boiling point impurities having a boiling point higher by 25°C or more than a boiling point of the solvent is 5 wt.% or less. |
