| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for producing a chip with a protection film using a pressure sensitive adhesive sheet with suppressed occurrence of film scattering and/or chip scattering, a composite sheet for forming a protection film, and a composite sheet with the protection film.SOLUTION: A pressure sensitive adhesive sheet includes: a substrate 2; and a pressure sensitive adhesive layer 3 laminated on one main surface 2A of the substrate 2. The pressure sensitive adhesive sheet 1 can be used when dicing a processing member W as one of constituents of a composite sheet 10 for forming a protection film provided with the pressure sensitive adhesive sheet 1 and a film 4 for forming a protection film laminated on at least one area of the main surface 1A on a side of the pressure sensitive adhesive layer 3. The substrate 2 has a mask layer 21 which lowers transmittance of energy rays, irradiated from another main surface 2B side, to one main surface 2A side of the substrate 2. |
