| 摘要 |
A semiconductor module 1 according to the present invention and equipped with a first substrate 10, a semiconductor element 20 obtained by joining a first electrode layer 21 to a first conductor layer 12, and a second substrate 30 obtained by joining a second conductor layer 32 to a second electrode layer 22, wherein: the first conductor layer 12 has a joining section 14 and a surrounding wall section 15 formed in a location surrounding the periphery of the joining section 14 when seen from a planar view, so as to be separated from or continuous with the joining section 14, and in a manner such that the top-end surface of the surrounding wall section 15 projects above from the joining section 14 surface; the first substrate 10 is joined to the second substrate 30 via the surrounding wall section 15; the surrounding wall section 15 surrounds the semiconductor module 1; and a resin section 40 is also formed in the semiconductor module 1 by filling the space between a first insulating plate 11 and a second insulating plate 31 with a resin. This semiconductor module 1 makes it possible to easily form a structure for resin-sealing. |
