发明名称 |
Heat exchanger |
摘要 |
A heat exchanger having an improved structure in which heat-exchanging efficiency can be improved includes a refrigerant pipe through which a refrigerant flows and a plurality of fins that are coupled to an outer circumferential surface of the refrigerant pipe, wherein the plurality of fins include a first region formed downstream in a direction in which air flows and a second region formed upstream in the direction in which air flows, and at least one coating layer is formed in the first region and the second region, and thicknesses of the first region and the second region are different from each other. |
申请公布号 |
EP2918960(B1) |
申请公布日期 |
2017.03.08 |
申请号 |
EP20150158252 |
申请日期 |
2015.03.09 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
Kim, Hong Suk;Kwon, Myong Jong;Oh, Seung Jin |
分类号 |
F28F19/02;B23P15/26;F25B39/02;F28D1/047;F28D21/00;F28F1/32;F28F17/00 |
主分类号 |
F28F19/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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