| 摘要 |
The invention provides a surface treatment copper foil and a printed wiring plate using the same. The surface treatment copper foil provided can obtain normal stripping strength even though a layer containing chromium content is not formed, and can maintain the stripping strength without power falling and with long-term anti-rust property even though in a high-temperature environment, in a wet state or in a state of being soaked in drug liquid. The surface treatment copper foil is characterized in that a micro-particle layer formed by copper particles, copper-nickel particles, copper-cobalt particles, and copper-nickel-cobalt particles, a layer formed by nickel or nickel-phosphorus, and a layer formed by alkali metal silicates and silane coupling agents are successively formed on one surface of the copper foil, the particle size of the micro-particle is less than 0.3 mum, and compared with the surface area of the copper foil formed by the micro-particle layer, the surface area of the micro-particle layer increases 60-900mum2 for every 177mum2. |
