Combined QFN and QFP semiconductor package

摘要

A semiconductor package includes a first lead frame type having a first type of package leads and a pre-molded portion, and a second lead frame type having a second type of package leads that surround a die pad and are supported by the pre-molded portion. An integrated circuit is attached to the die pad and electrically connected to the first and second types of leads with bond wires. A mold compound, which forms a mold cap, covers the first and second lead frame types, the integrated circuit and the bond wires. The first lead frame type may be a QFP type and the second lead frame type may be a QFN type.

主权项

1. A semiconductor package, comprising:
a die pad having an upper surface and a lower surface; an integrated circuit attached on the upper surface of the die pad; a plurality of first package type leads surrounding the die pad, wherein each of the plurality of first package type leads is electrically connected to the integrated circuit with first bond wires; a plurality of second package type leads that surround the first package type leads, wherein the second package type leads have proximal ends that are positioned above the plurality of first package type leads, wherein the proximal ends of the second package type leads are electrically connected to the integrated circuit with second bond wires, and wherein the second package type leads are of a different lead type than the first package type leads; and a mold cap that at least partially covers the die pad, the integrated circuit, the plurality of first and second package type leads, and the first and second bond wires; a pre-molded portion for positioning the first package type leads and supporting the second package type leads over the first package type leads, wherein the pre-molded portion includes a structure located between leads of the plurality of first package type leads and leads of the plurality of second package type leads in a direction orthogonal to the upper surface of the die pad, wherein the structure is formed separately from the mold cap.