发明名称 Flexible electronic system with wire bonds
摘要 Generally discussed herein are systems and apparatuses that can include apparatuses, systems, or method for a flexible, wire bonded device. According to an example an apparatus can include (1) a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit, (2) a second rigid circuit comprising a second plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit, or (3) a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the second plurality of bond pads.
申请公布号 US9591758(B2) 申请公布日期 2017.03.07
申请号 US201414227805 申请日期 2014.03.27
申请人 Intel Corporation 发明人 Aleksov Aleksandar Aleks;Kobrinsky Mauro;Swan Johanna;Dias Rajendra C.
分类号 H05K1/00;H05K1/14;H05K1/02;H05K1/03;H05K1/11;H05K3/46;H01L23/00 主分类号 H05K1/00
代理机构 Schwegman Lundberg & Woessner, P.A. 代理人 Schwegman Lundberg & Woessner, P.A.
主权项 1. An apparatus comprising: a first rigid circuit comprising a first plurality of bond pads proximate to a first edge of the first rigid circuit and a second plurality of bond pads proximate a second edge of the first rigid circuit, wherein the first edge and the second edge of the first rigid circuit share a common vertex; a second rigid circuit comprising a third plurality of bond pads proximate to a first edge of the second rigid circuit, the second rigid circuit adjacent the first rigid circuit and the first edge of the second rigid circuit facing the first edge of the first rigid circuit; a third rigid circuit comprising a fourth plurality of bond pads proximate a first edge of the third rigid circuit, the first edge of the third rigid circuit facing the second edge of the first rigid circuit; a first plurality of wire bonded wires, each wire bonded wire of the first plurality of wire bonded wires electrically and mechanically connected to a bond pad of the first plurality of bond pads and a bond pad of the third plurality of bond pads such that the first rigid circuit is free to rotate with respect to the second rigid circuit about a rotational axis generally parallel to the first edge of the first rigid circuit; a second plurality of wire bonded wires, each wire bonded wire of the second plurality of wire bonded wires electrically and mechanically connected to a bond pad of the second plurality of bond pads and a bond pad of the fourth plurality of bond pads; and a flexible carrier, wherein the first rigid circuit, second rigid circuit, and third rigid circuit are situated on the flexible carrier.
地址 Santa Clara CA US