| 发明名称 |
Method for processing a wafer and wafer structure |
| 摘要 |
A method for processing a wafer in accordance with various embodiments may include: removing wafer material from an inner portion of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer, and printing material into the inner portion of the wafer using the structure as a printing mask. A method for processing a wafer in accordance with various embodiments may include: providing a carrier and a wafer, the wafer having a first side and a second side opposite the first side, the first side of the wafer being attached to the carrier, the second side having a structure at an edge region of the wafer, the structure at least partially surrounding an inner portion of the wafer; and printing material onto at least a portion of the second side of the wafer. |
| 申请公布号 |
US9589880(B2) |
申请公布日期 |
2017.03.07 |
| 申请号 |
US201314049340 |
申请日期 |
2013.10.09 |
| 申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
Yeduru Srinivasa Reddy;Gasser Karl Heinz;Woehlert Stefan;Mayer Karl;Santos Rodriguez Francisco Javier |
| 分类号 |
H01L21/04;H01L23/498;H01L21/48;H01L21/683;H01L23/00 |
主分类号 |
H01L21/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for processing a wafer, the method comprising:
removing wafer material from an inner portion of a back side of the wafer to form a structure at an edge region of the wafer to at least partially surround the inner portion of the wafer; printing material into the inner portion of the wafer using the structure as a printing mask in order to control the thickness of the material during printing according to the height of the structure, removing the structure at the edge region from the wafer so that the printed material remains in the inner portion of the wafer; and singulating the wafer after the removal of the structure from the wafer with the printed material remaining in the inner portion of the wafer, wherein the wafer is a semiconductor wafer. |
| 地址 |
Neubiberg DE |
