发明名称 Housing features of an electronic device
摘要 An enclosure and a method for forming an enclosure are disclosed. The enclosure may be formed from metal, such as aluminum, and further include a non-metal portion allowing for transmission and receipt of electromagnetic waves. The non-metal portion may be interlocked to the enclosure and in particular, to a region within the enclosure including a first material having a relatively high strength and stiffness compared to the non-metal portion. Interlocking means may include forming dovetail cuts into the enclosure to receive the non-metal portion, a hole or cavity drilled into the enclosure which includes internal threads, and a rod inserted into the first material to provide a tension to the non-metal portion. Methods of assembling internal components using anodization are also disclosed.
申请公布号 US9591110(B2) 申请公布日期 2017.03.07
申请号 US201514618744 申请日期 2015.02.10
申请人 APPLE INC. 发明人 Hill Matthew D.;Krass Derek C.;Bustle Benjamin Shane;Browning Lucy Elizabeth;Wittenberg Michael Benjamin;Smith James B.;Shukla Ashutosh Y.;Myers Scott A.
分类号 H04M1/02 主分类号 H04M1/02
代理机构 Brownstein Hyatt Farber Schreck, LLP 代理人 Brownstein Hyatt Farber Schreck, LLP
主权项 1. An enclosure, comprising: a first region formed in an interior portion of the enclosure, the first region comprising a first material molded in the first region; a second region formed in an exterior portion of the enclosure, the second region comprising a second material different than the first material, the second material molded in the second region; a protrusion integrally formed with the enclosure, the protrusion extending through the first material; and means for interlocking the second material to the first material, wherein the first material engages the second material to define an interface region that allows transmission of electromagnetic waves.
地址 Cupertino CA US