Package apparatus and manufacturing method thereof

摘要

A package apparatus includes a first package module, a second package module and multiple conductive elements. The first package module includes a first molding compound layer, a first conductive pillar layer disposed in the first molding compound layer, a first internal component, and a first protection layer. The first internal component electrically connects to the first conductive pillar layer and disposed in the first molding compound layer. The first protection layer is disposed on the first molding compound layer and the first conductive pillar layer. The second package module includes a second molding compound layer, a second conductive pillar layer disposed in the second molding compound layer, and a second internal component. The second internal component electrically connects to the second conductive pillar layer and disposed in the second molding compound layer. The conductive elements are disposed between the first and the second conductive pillar layers.

主权项

1. A package apparatus, comprising:
a first package module, comprising:
a first molding compound layer;a first conductive pillar layer, disposed in the first molding compound layer, comprising:
a plurality of first surfaces facing a first direction; anda plurality of second surfaces facing a second direction opposite to said first direction;a first internal component disposed in the first molding compound layer and electrically connected to the first conductive pillar layer; anda first protection layer disposed on the first molding compound layer and the first surfaces; a second package module, comprising:
a second molding compound layer;a second conductive pillar layer, disposed in the second molding compound layer, comprising:
a plurality of third surfaces, facing said second direction; anda plurality of fourth surfaces facing said first direction; anda second internal component disposed in the second molding compound layer and electrically connected to the second conductive pillar layer; and a plurality of conductive elements disposed between the first conductive pillar layer and the second conductive pillar layer, wherein the first molding compound layer has a plurality of grooves intercalated with said plurality of second surfaces on its upper surface, or the second molding compound layer has a plurality of grooves intercalated with said plurality of fourth surfaces on its lower surface, each groove having:
an opening, anda basin, spaced from said first conductive pillar layer and said second conductive pillar layer, below the second or fourth surfaces,wherein said opening is wider than said basin.