| 发明名称 | Assembly of an integrated circuit chip and of a plate | ||
| 摘要 | An assembly is made of an integrated circuit chip and a plate. At least one channel is arranged between the chip and the plate. The channel is delimited by metal sidewalls at least partially extending from one surface of the chip to an opposite surface of the plate. The assembly is encapsulated in a body that includes an opening extending to reach the channel. The plate may be one of an interposer, an integrated circuit chip, a support of surface-mount type, or a metal plate. | ||
| 申请公布号 | US9589874(B2) | 申请公布日期 | 2017.03.07 |
| 申请号 | US201514857041 | 申请日期 | 2015.09.17 |
| 申请人 | STMicroelectronics (Crolles 2) SAS;SOCPRA Sciences et Génie S.E.C. | 发明人 | Collin Louis-Michel;Frechette Luc Guy;Lhostis Sandrine |
| 分类号 | H01L23/48;H01L23/495;H01L21/311;H01L21/48;H01L21/52;H01L21/54;H01L21/56;H01L23/31;H01L23/42;H01L23/492;H01L23/00;H01L25/065;H01L25/00;H01L23/473 | 主分类号 | H01L23/48 |
| 代理机构 | Gardere Wynne Sewell LLP | 代理人 | Gardere Wynne Sewell LLP |
| 主权项 | 1. An apparatus, comprising: an integrated circuit chip; and a plate; wherein at least one channel arranged between the integrated circuit chip and the plate extends from one edge to another edge of a smaller one of the integrated circuit chip and the plate, and is delimited by metal sidewalls at least partially extending from a surface of the integrated circuit chip toward an opposite surface of the plate, the metal sidewalls extending continuously from the one edge to the another edge of the smaller one of the integrated circuit chip and the plate. | ||
| 地址 | Crolles FR | ||