发明名称 Modular design of a high power, low passive intermodulation, active universal distributed antenna system interface tray
摘要 A modular high power, low passive intermodulation, active, universal, distributed antenna system interface tray that includes one or more front-end RF frequency duplexers instead of a high power, low passive intermodulation attenuator to achieve superior FIM performance. A cable switch matrix allows for the use of the system among varying power levels* and accomplishes the above in a modular architecture.
申请公布号 US9590318(B2) 申请公布日期 2017.03.07
申请号 US201414779635 申请日期 2014.07.24
申请人 Intel Corporation 发明人 Famili Nader;Subedi Purna C.;Buch Yatin;Cook Jason;Zhu Changru;Sideris George;Balue Robert
分类号 H05K5/00;H01Q21/00;H01P1/213;H05K7/14;H04B1/525 主分类号 H05K5/00
代理机构 Schwegman Lundberg & Woessner, P.A. 代理人 Schwegman Lundberg & Woessner, P.A.
主权项 1. A modular high power, low passive intermodulation (PIM), active, universal distributed antenna system (DAS) interface tray for providing an interface between a base telecommunication station (BTS) and the DAS that can attenuate the signal input radio frequency (RF) power level from the BTS to signal output RF power levels that are harmonious with the requirements of a DAS network while inducing very low PIM levels into the attenuated RF signal, the interface tray comprising: a main chassis; a plurality of RF modules coupled to the main chassis; and a Supervisor Control Power Supply Unit (PSU) module coupled to the main chassis, wherein the RF modules comprise a downlink section comprising a cable switch matrix comprising a set of cable jumpers and a series of stepped attenuators, the set of cable jumpers configurable on a front panel to attenuate the downlink transmit signals received from the BTS based on input RF power levels of the downlink transmit signals received from the BTS to reduce PIM levels.
地址 Santa Clara CA US