Solderless electrical interconnections in a high speed photonic package

摘要

An assembly that provides solderless electrical interconnection between two devices provided with electrical contact lands that are distributed in plane Land Grid Arrays (LGA's). One of the devices can be a package containing an electronic or opto-electronic device and the other device can be a PCB. The alignment of the lands of the LGA's is provided by guides that include a frame having vertical walls and centering pins inserted into metallized via-holes provided in the PCB, the dimensions of the frame allowing the sliding insertion and extraction of the package. Electrical connection between the lands of the two LGA's is provided by a contactor pad placed between the package and the PCB. The assembly includes a cover removably attached to the frame by a locking mechanism, the cover being provided with one or more elastic members which exert a downward force over the package compressing it against the contactor pad.

主权项

1. An assembly that provides solderless electrical interconnections between two devices provided with electrical contact lands that are distributed in plane land grid arrays (LGA's) symmetrically held in an opposing relation so that the contact lands on the LGA of a first one of the devices are fronted on the contact lands on the LGA of a second one of the devices, comprising:
the first device is housed in a first enclosure having vertical sidewalls; the second device is a printed circuit board (PCB); an anisotropic contactor pad between the contact lands of the first device and the contact lands of the second device; a guide frame attached to the PCB; and at least one elastic member situated in a cover superimposed over the first enclosure and removably attached to the guide frame by a locking mechanism.