发明名称 |
Mounting table and plasma processing apparatus |
摘要 |
A mounting table includes an electrostatic chuck, a base, and a cylindrical sleeve. The electrostatic chuck has a top surface to be exposed to plasma and a bottom surface opposite to the top surface, and a first through-hole is formed through the electrostatic chuck. The base is bonded to the bottom surface of the electrostatic chuck by a first adhesive, and a second through-hole is formed through the base. The second through-hole communicates with the first through-hole and has a diameter larger than a diameter of the first through-hole. The sleeve is bonded to the bottom surface of the electrostatic chuck by a second adhesive while communicating with the first through-hole. |
申请公布号 |
US9589823(B2) |
申请公布日期 |
2017.03.07 |
申请号 |
US201214367058 |
申请日期 |
2012.12.17 |
申请人 |
TOKYO ELECTRON LIMITED |
发明人 |
Sasaki Yasuharu;Sugamata Takeshi;Aoto Tadashi |
分类号 |
B23K10/00;H01L21/683;H01L21/3065;H01J37/32 |
主分类号 |
B23K10/00 |
代理机构 |
Rothwell, Figg, Ernst & Manbeck, P.C. |
代理人 |
Rothwell, Figg, Ernst & Manbeck, P.C. |
主权项 |
1. A mounting table comprising:
an electrostatic chuck having a top surface to be exposed to a plasma and a bottom surface opposite to the top surface, the electrostatic chuck including a first through-hole formed therethrough; a base bonded to the bottom surface of the electrostatic chuck by a first adhesive, the base including a second through-hole formed therethrough, the second through-hole communicating with the first through-hole and having a diameter larger than a diameter of the first through-hole; and a tubular sleeve, wherein the sleeve is bonded to the bottom surface of the electrostatic chuck by a second adhesive while communicating with the first through-hole, wherein the second adhesive has a higher resistance to the plasma or radicals than that of the first adhesive, wherein the first adhesive is an organic adhesive including a silicon-based material, an acrylic-based or acrylate-based material, or a polyimide silica-based material, wherein the second adhesive is an inorganic adhesive including a ceramic material, and wherein the sleeve is spaced apart from an inner wall of the second through-hole. |
地址 |
Tokyo JP |