| 发明名称 | Semiconductor device including an embedded surface mount device and method of forming the same | ||
| 摘要 | Embodiments of the present disclosure include devices and methods of forming the same. An embodiment is a device including a solder resist coating over a first side of a substrate, an active surface of a die bonded to the first side of the substrate by a first connector, and a surface mount device mounted to the die by a second set of connectors, the surface mount device being between the die and the first side of the substrate, the surface mount device being spaced from the solder resist coating. | ||
| 申请公布号 | US9589938(B2) | 申请公布日期 | 2017.03.07 |
| 申请号 | US201514981171 | 申请日期 | 2015.12.28 |
| 申请人 | Taiwan Semiconductor Manufacturing Company, Ltd. | 发明人 | Chen Hsien-Wei;Chen Ying-Ju |
| 分类号 | H01L23/00;H01L23/48;H01L25/065;H01L23/31;H01L23/538;H01L23/12;H01L25/10;H01L25/00;H01L23/13;H01L23/498;H01L21/56;H01L23/50 | 主分类号 | H01L23/00 |
| 代理机构 | Slater Matsil, LLP | 代理人 | Slater Matsil, LLP |
| 主权项 | 1. A device comprising: a polymer layer over a first side of a substrate, at least a portion of the polymer layer being removed over a first portion of the first side of the substrate; a die bonded to the first side of the substrate by a first connector; and a surface mount device mounted to the die, the surface mount device being between the die and the first side of the substrate, the first portion of the first side of the substrate being over the surface mount device. | ||
| 地址 | Hsin-Chu TW | ||