Bridge interconnect with air gap in package assembly

摘要

Embodiments of the present disclosure are directed towards techniques and configurations for a bridge interconnect assembly that can be embedded in a package assembly. In one embodiment, a package assembly includes a package substrate configured to route electrical signals between a first die and a second die and a bridge embedded in the package substrate and configured to route the electrical signals between the first die and the second die, the bridge including a bridge substrate, one or more through-hole vias (THVs) formed through the bridge substrate, and one or more traces disposed on a surface of the bridge substrate to route the electrical signals between the first die and the second die. Routing features including traces and a ground plane of the bridge interconnect assembly may be separated by an air gap. Other embodiments may be described and/or claimed.

主权项

1. A bridge comprising:
a ground plane configured to route a ground signal; one or more through-hole vias (THVs) formed through a bridge substrate of the bridge; and a plurality of traces disposed on a surface of the bridge substrate to route electrical signals between a first die and a second die through respective THVs, wherein at least two traces of the plurality of traces are separated by an air gap, and the air gap is disposed between the plurality of traces on the surface of the bridge substrate and the ground plane.