发明名称 Lens module applied to camera
摘要 A lens module includes a first wafer level lens group, a second wafer level lens group, a first sensor, and a second sensor. The first wafer level lens group has a first optical axis. The second wafer level lens group has a second optical axis. The first optical axis is parallel with the second optical axis, and the first wafer level lens group and the second wafer level lens group are integrally formed. The first sensor is disposed corresponding to the first wafer level lens group, and the first sensor is disposed on the first optical axis. The second sensor is disposed corresponding to the second wafer level lens group, and the second sensor is disposed on the second optical axis.
申请公布号 US9591287(B2) 申请公布日期 2017.03.07
申请号 US201514601607 申请日期 2015.01.21
申请人 HIMAX TECHNOLOGIES LIMITED 发明人 Lu Yin-Dong;Kuo Han-Yi
分类号 H04N3/14;H04N5/225;H04N13/02;G02B13/00 主分类号 H04N3/14
代理机构 Locke Lord LLP 代理人 Locke Lord LLP ;Xia, Esq. Tim Tingkang
主权项 1. A lens module, comprising: a first wafer level lens group having a first optical axis; a second wafer level lens group having a second optical axis, wherein the first optical axis is parallel with the second optical axis, and the first wafer level lens group and the second wafer level lens group are integrally formed; a first sensor disposed corresponding to the first wafer level lens group, wherein the first sensor is disposed on the first optical axis; a second sensor disposed corresponding to the second wafer level lens group, wherein the second sensor is disposed on the second optical axis; an image lens group having an image optical axis parallel with the first optical axis, wherein the image lens group has a size different from that of the first wafer level lens group and the second wafer level lens group; and an image sensor disposed corresponding to the image lens group, wherein the image sensor is disposed on the image optical axis.
地址 Tainan TW