发明名称 |
Microwave monolithic integrated circuit (MMIC) having integrated high power thermal dissipating load |
摘要 |
A Microwave Monolithic Integrated Circuit (MMIC) having an integrated high power load. The MMIC includes a microwave transmission line and a resistive load coupled to a terminating end of the microwave transmission line. The resistive load comprises a hollow resistive material disposed on sidewalls of a via passing through a substrate, the resistive material having an upper portion electrically connected to a terminating end of a strip conductor of the microwave transmission line strip conductor and a lower portion electrically connected to the ground plane. |
申请公布号 |
US9589917(B1) |
申请公布日期 |
2017.03.07 |
申请号 |
US201615075874 |
申请日期 |
2016.03.21 |
申请人 |
Raytheon Company |
发明人 |
Rodriguez Istvan;Laighton Christopher M.;Bielunis Alan J. |
分类号 |
H01L23/66;H01L23/64;H01L23/48;H01L27/085;H01L29/20 |
主分类号 |
H01L23/66 |
代理机构 |
Daly, Crowley, Mofford & Durkee, LLP |
代理人 |
Daly, Crowley, Mofford & Durkee, LLP |
主权项 |
1. A microwave circuit, comprising:
a microwave transmission line, comprising:
a substrate;a first electrical conductor disposed on an upper surface of the substrate;a second electrical conductor disposed on a bottom surface of the substrate; and a resistor comprising a hollow resistor comprising a resistive material passing through the substrate, the hollow resistor being electrically connected between the first electrical conductor and the second electrical conductor. |
地址 |
Waltham MA US |