发明名称 Camera module having support boss
摘要 A camera module according to an exemplary embodiment of the present disclosure is proposed, the camera module including a PCB (Printed Circuit Board) mounted with an image sensor, a housing member arranged at an upper surface of the PCB, a bobbin movably positioned at an inner side of the housing member, an upper elastic member connected to an upper surface of the housing member and to an upper surface of the bobbin, and a space forming part formed at one side of the housing member to provide a moving space to the upper elastic member when the bobbin makes a relatively vertical movement to the housing member.
申请公布号 US9591191(B2) 申请公布日期 2017.03.07
申请号 US201514588479 申请日期 2015.01.02
申请人 LG Innotek Co., Ltd. 发明人 Park Sang Ok;Lee Seong Min;Lee Jun Taek
分类号 H04N5/225 主分类号 H04N5/225
代理机构 KED & Associates LLP 代理人 KED & Associates LLP
主权项 1. A camera module, the camera module comprising: a cover member including an inner surface that extends inward from a periphery; a housing member disposed below the cover member; a bobbin disposed inside the housing member; an elastic member coupled to the cover member and the bobbin, wherein the elastic member includes a first fixation portion coupled to the cover member, a second fixation portion coupled to the bobbin, and a connection portion connecting the first and second fixation portions; and a support boss protruded from the inner surface of the cover member, wherein the support boss is coupled to the first fixation portion, wherein the connection portion is spaced apart from the inner surface of the cover member, wherein the first fixation portion of the elastic member is disposed between the housing member and the inner surface of the cover member, and wherein the support boss is downwardly protruded from a specific area of the inner surface of the cover member, wherein the specific area is spaced a prescribed distance from the periphery of the inner surface of the cover member.
地址 Seoul KR