| 发明名称 | Semiconductor package | ||
| 摘要 | A semiconductor package includes: an upper package to which an element is mounted, and which includes a metal pad portion; a metal post connected to the metal pad portion; and a lower package to which an element is mounted, and which is connected to the metal post. | ||
| 申请公布号 | US9589878(B2) | 申请公布日期 | 2017.03.07 |
| 申请号 | US201514937935 | 申请日期 | 2015.11.11 |
| 申请人 | LG INNOTEK CO., LTD. | 发明人 | Ryu Sung Wuk;Kim Dong Sun;Seo Hyun Seok;Lee Ji Haeng |
| 分类号 | H01L23/498;H01L25/10;H01L25/00;H01L23/00 | 主分类号 | H01L23/498 |
| 代理机构 | LRK Patent Law Firm | 代理人 | LRK Patent Law Firm |
| 主权项 | 1. A semiconductor package comprising: an upper package to which an element is mounted, and which includes a metal post fixed by a metal pad portion, a surface treatment layer on a surface of the metal post, and a solder layer on a surface of the surface treatment layer; and a lower package to which an element is mounted, and which is connected to the metal post, wherein the metal post is protruded downward from a bottom surface of the upper package. | ||
| 地址 | Seoul KR | ||