| 发明名称 | Semiconductor devices with moving members and methods for making the same | ||
| 摘要 | The present disclosure provides an embodiment of a micro-electro-mechanical system (MEMS) structure, the MEMS structure comprising a MEMS substrate; a first and second conductive plugs of a semiconductor material disposed on the MEMS substrate, wherein the first conductive plug is configured for electrical interconnection and the second conductive plug is configured as an anti-stiction bump; a MEMS device configured on the MEMS substrate and electrically coupled with the first conductive plug; and a cap substrate bonded to the MEMS substrate such that the MEMS device is enclosed therebetween. | ||
| 申请公布号 | US9586811(B2) | 申请公布日期 | 2017.03.07 |
| 申请号 | US201113157994 | 申请日期 | 2011.06.10 |
| 申请人 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. | 发明人 | Chu Chia-Hua;Chang Kuei-Sung;Lin Chung-Hsien |
| 分类号 | H01L23/48;B81B3/00;B81B7/00;B81C1/00 | 主分类号 | H01L23/48 |
| 代理机构 | Haynes and Boone, LLP | 代理人 | Haynes and Boone, LLP |
| 主权项 | 1. A micro-electro-mechanical system (MEMS) structure, the MEMS structure comprising: a MEMS substrate; a silicon layer bonded to the MEMS substrate; a first and second conductive plugs of a semiconductor material embedded in the silicon layer, wherein the first conductive plug is configured for electrical interconnection and the second conductive plug is configured as an anti-stiction bump; a MEMS device configured on the MEMS substrate and electrically coupled with the first conductive plug; and a cap substrate bonded to the MEMS substrate such that the MEMS device is enclosed therebetween. | ||
| 地址 | Hsin-Chu TW | ||