发明名称 |
ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE |
摘要 |
[Problem] To provide an electroconductive material with which it is possible to suppress the occurrence of black soot in a cured object, selectively dispose solder in electroconductive particles on an electrode, and improve electroconductive reliability. [Solution] An electroconductive material according to the present invention includes, in an outer surface portion of an electroconductive part, a plurality of electroconductive particles that have solder, a heat-curable component, and flux, and includes as the heat-curable component or the flux a compound having an isocyanuric backbone, the viscosity of the electroconductive material at the melting point of the solder in the electroconductive particles being 0.1-20 Pa·s. |
申请公布号 |
WO2017033930(A1) |
申请公布日期 |
2017.03.02 |
申请号 |
WO2016JP74527 |
申请日期 |
2016.08.23 |
申请人 |
SEKISUI CHEMICAL CO., LTD. |
发明人 |
ITOU, Masahiro;SADANAGA, Shuujirou;ISHIZAWA, Hideaki;KUBOTA, Takashi |
分类号 |
H01B1/22;C09J9/02;C09J201/00;H01B1/00;H01B5/16;H01L21/60;H05K1/14;H05K3/32;H05K3/34 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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