FLEXIBLE ELECTRONIC ASSEMBLIES WITH EMBEDDED ELECTRONIC DEVICES AND METHODS FOR THEIR FABRICATION

摘要

A flexible electronic assembly includes a flexible current-carrying device, an electrically insulating flexible substrate, and an electronic device embedded in the substrate. The electronic device is mounted face-down on the current-carrying device such that a contact side or component side of the electronic device faces the current-carrying device and is positioned at an interface between the current-carrying device and the substrate. The current-carrying device, substrate, and electronic device are co-planar at the interface. This configuration enables the flexible electronic assembly to have an ultra-thin thickness, for example on the order of micrometers.

主权项

1. A flexible electronic assembly, comprising:
a flexible current-carrying device comprising a front side, an opposing back side, a first electrically insulating material, and a metal component embedded in the first electrically insulating material; a flexible substrate composed of a second electrically insulating material and comprising a front side and an opposing back side; and an electronic device embedded in the flexible substrate and comprising a front side, an opposing back side, and an electrical contact on the front side, wherein the front side of the flexible substrate and the front side of the electronic device contact the back side of the flexible current-carrying device at an interface, such that the flexible substrate and the electronic device are coplanar with the flexible current-carrying device at the interface.