ELECTROCONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

摘要

Provided is an electroconductive material with which it is possible to selectively dispose solder in electroconductive particles on an electrode, and minimize migration and keep the connection resistance low even when the electrode width and the electrode pitch are reduced. The electroconductive material according to the present invention: contains, on the outer surface portion of an electroconductive part, a heat-curable compound, an acid anhydride heat curing agent, and a plurality of electroconductive particles having solder; and exhibits a viscosity at 50°C of 10-200 Pa•s.