UNIVERSAL BGA SUBSTRATE

摘要

A universal substrate for assembling ball grid array (BGA) type integrated circuit packages has a non-conducting matrix, an array of conducting vias extending between top and bottom surfaces of the matrix, and one or more instances of each of two or more different types of fiducial pairs on the top surface of the matrix. Each instance of each different fiducial pair indicates a location of a different via sub-array of the substrate for a different BGA package of a particular package size. The same substrate can be used to assemble BGA packages of different size, thereby avoiding having to design a different substrate for each different BGA package size.

主权项

1. A substrate for ball grid array (BGA) packages, the substrate comprising:
a non-conducting matrix having a top surface and a bottom surface; an array of conducting vias extending between the top and bottom surfaces of the matrix; one or more instances of a first fiducial pair on the top surface of the matrix, wherein each instance of the first fiducial pair indicates a location of a different via sub-array for a different BGA package of a first package size; and one or more instances of a second fiducial pair, different from the first fiducial pair, on the top surface of the matrix, wherein each instance of the second fiducial pair indicates a location of a different via sub-array for a different BGA package of a second package size different from the first package size.