| 发明名称 |
METHOD FOR MANUFACTURING BLIND HOLE OF INSULATING SUBSTRATE FOR ELECTRONIC DEVICE |
| 摘要 |
The present disclosure provides a method for manufacturing a blind hole of an insulating substrate for an electronic device. The method includes following steps. A patterned photoresist layer is formed over the insulating substrate. The patterned photoresist layer has an opening exposing a portion of the insulating substrate. A wet etching process is performed to remove the exposed insulating substrate to form a blind hole in the opening. |
| 申请公布号 |
US2017062102(A1) |
申请公布日期 |
2017.03.02 |
| 申请号 |
US201514972107 |
申请日期 |
2015.12.17 |
| 申请人 |
General Interface Solution Limited ;Interface Optoelectronics (ShenZhen) Co., Ltd. |
发明人 |
CHANG Chun-Te;KUO Yu-Pi;LIU Chung-Wu;CHUANG Wei-Chung |
| 分类号 |
H01B19/04;H01B3/08;C03C15/00 |
主分类号 |
H01B19/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method for manufacturing a blind hole of an insulating substrate for an electronic device, comprising:
forming a patterned photoresist layer over the insulating substrate, the patterned photoresist layer having an opening exposing a portion of the insulating substrate; and performing a wet etching process to remove the portion of the insulating substrate to form a blind hole in the opening. |
| 地址 |
Miaoli County TW |
