SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

A substrate is held and rotated in a horizontal attitude by a rotation holder. A coating liquid is supplied by a coating liquid supplier to a surface to be processed of the substrate rotated by the rotation holder. A first removal liquid is supplied by a first removal liquid supplier to a first annular region at a peripheral portion of the substrate rotated by the rotation holder before the coating liquid supplied by the coating liquid supplier loses fluidity. In this state, a supply position of the first removal liquid by the first removal liquid supplier is moved from an inner edge to an outer edge of the first annular region.

主权项

1. A substrate processing apparatus that forms a film of a coating liquid on a substrate, comprising:
a rotation holder that holds and rotates the substrate in a horizontal attitude; a coating liquid supplier configured to supply the coating liquid to one surface of the substrate; a first removal liquid supplier configured to supply a first removal liquid that removes the coating liquid to a peripheral portion of the one surface of the substrate; and a controller that controls operations of the coating liquid supplier and the first removal liquid supplier, wherein the controller controls the coating liquid supplier to supply the coating liquid to the one surface of the substrate rotated by the rotation holder, and controls the first removal liquid supplier to supply the first removal liquid to a first annular region at the peripheral portion of the substrate rotated by the rotation holder, and controls the first removal liquid supplier such that a supply position of the first removal liquid is moved from an inner edge to an outer edge of the first annular region, before the coating liquid supplied by the coating liquid supplier loses fluidity.