| 摘要 |
An optoelectronic component (1) is disclosed, comprising a carrier (2), which comprises a molded body, a light-emitting semiconductor body (3) having a first segment (30) and a second segment (31). Furthermore, the optoelectronic component (1) comprises an electrical conducting path (4a), which is arranged on the first segment (30) and on the second segment (31) on a side of the light-emitting semiconductor body (3) facing the carrier (2), and a first electrical connecting structure (5a) and a second electrical connecting structure (5b), each of which electrically connects the first segment (30) and the second segment (31) to one another and which are electrically connected to one another by means of the electrical conducting path (4a), wherein the first segment (30) and the second segment (31) are interconnected in an antiparallel manner and the first electrical connecting structure (5a), the second electrical connecting structure (5b) and the electrical conducting path (4a) are completely covered by the molded body. |
