AIR CAVITY PACKAGE

摘要

A leadframe and air cavity packages formed using the leadframe are described. Using the leadframe, several air cavity packages can be quickly formed at one time. Further, electrical components can be placed within and interconnected with the air cavity packages easily by repositioning several devices at a time using the leadframe. After assembly, the air cavity packages can be separated from the leadframe. The air cavity packages can include a slug, a plastic frame that surrounds the slug and forms an air cavity, and a cover that encloses the air cavity. The air cavity package further includes one or more conductive leads of the leadframe that extend through the plastic frame and are exposed within the air cavity. The conductive leads can be relied upon to bond out components secured within the air cavity. Finally, the cover can be secured to enclose the air cavity.

主权项

1. An air cavity package, comprising:
a heat slug comprising a first major surface, a second major surface, and an interlocking edge surface; a plastic frame that surrounds the interlocking edge surface and forms an air cavity bounded in part by the first major surface of the heat slug, the plastic frame comprising:
at least one aperture for securing the air cavity package;a first platform level within the air cavity; anda second platform level within the air cavity; and at least one conductive lead that extends from outside the plastic frame, through at least a portion of the plastic frame, and is exposed within the air cavity at the first platform level to bond out at least one electrical contact of a component within the air cavity.