发明名称 METHOD FOR MANUFACTURING AN OPTICAL UNIT AND ELECTRONIC APPARATUS
摘要 A purpose of the present disclosure is to provide an optical unit that is capable of effectively sealing one or a plurality of optical devices even without a special material, a special structure, etc.;In an optical unit of the present disclosure, the sealing section (50) includes: a circular seal section (51) surrounding one or a plurality of optical devices (40) on a wiring substrate from an in-plane direction of the wiring substrate; and an inside filling section (52) with which inside of the seal section (51) is filled and that seals the one or plurality of optical devices (40). The optical devices (40) are each a light emitting unit, a light receiving device, an image sensor, an X-ray sensor, or a power generating device. The seal section (51) and the inside filling section (52) are each configured of a cured thermosetting resin. The inside filling section (52) has light transmittance that is higher than light transmittance of the seal section (51). The inside filling section (52) has a modulus of elasticity that is smaller than a modulus of elasticity of the seal section (51).
申请公布号 US2017062662(A1) 申请公布日期 2017.03.02
申请号 US201615290549 申请日期 2016.10.11
申请人 Sony Semiconductor Solutions Corporation 发明人 Aoyagi Akiyoshi;Song Gyongsok
分类号 H01L33/48;H01L33/56;H01L25/075;H01L31/0203;H01L25/00;H01L25/04 主分类号 H01L33/48
代理机构 代理人
主权项 1. A method of manufacturing an optical unit, the method comprising: preparing a mounting substrate and a counter substrate, the mounting substrate including one or a plurality of optical devices that are mounted on a wiring substrate, and the counter substrate being arranged on a one-or-plurality-of optical device side in a relationship with the mounting substrate; arranging a thermosetting first resin to surround all of the one or plurality of optical devices on the wiring substrate from an in-plane direction of the wiring substrate, and subsequently filling inside of the first resin with a thermosetting second resin in a state in which the first resin is incompletely cured, the second resin having a modulus of elasticity that is smaller than a modulus of elasticity of the first resin and having light transmittance that is higher than light transmittance of the first resin; and curing the first resin and the second resin together by a heat process.
地址 Kanagawa JP