发明名称 |
BURIED INTERCONNECT FOR SEMICONDUCTOR CIRCUITS |
摘要 |
A semiconductor circuit comprises a Front End of Line (FEOL) comprising a plurality of transistors, each of which having a source region, a drain region and a gate region arranged between the source region and the drain region and comprising a gate electrode. The semiconductor circuit also comprises a buried interconnect that is arranged in the FEOL and electrically connected to the gate region from below through a bottom contact portion of the gate electrode. By using a buried interconnect the routing of the circuit may be facilitated. |
申请公布号 |
US2017062421(A1) |
申请公布日期 |
2017.03.02 |
申请号 |
US201615247127 |
申请日期 |
2016.08.25 |
申请人 |
IMEC VZW |
发明人 |
Cosemans Stefan;Raghavan Praveen;Demuynck Steven;Ryckaert Julien |
分类号 |
H01L27/088;H01L21/768;H01L21/8234;H01L23/528;H01L27/02 |
主分类号 |
H01L27/088 |
代理机构 |
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代理人 |
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主权项 |
1. A semiconductor circuit, comprising:
a front-end-of-line comprising a plurality of transistors, each transistor comprising a source region, a drain region, and a gate region, wherein the gate region is situated between the source region and the drain region and comprises a gate electrode; and a first buried interconnect situated in the front end of line and electrically connected to the gate region from below through a bottom contact portion of the gate electrode. |
地址 |
Leuven BE |