发明名称 BURIED INTERCONNECT FOR SEMICONDUCTOR CIRCUITS
摘要 A semiconductor circuit comprises a Front End of Line (FEOL) comprising a plurality of transistors, each of which having a source region, a drain region and a gate region arranged between the source region and the drain region and comprising a gate electrode. The semiconductor circuit also comprises a buried interconnect that is arranged in the FEOL and electrically connected to the gate region from below through a bottom contact portion of the gate electrode. By using a buried interconnect the routing of the circuit may be facilitated.
申请公布号 US2017062421(A1) 申请公布日期 2017.03.02
申请号 US201615247127 申请日期 2016.08.25
申请人 IMEC VZW 发明人 Cosemans Stefan;Raghavan Praveen;Demuynck Steven;Ryckaert Julien
分类号 H01L27/088;H01L21/768;H01L21/8234;H01L23/528;H01L27/02 主分类号 H01L27/088
代理机构 代理人
主权项 1. A semiconductor circuit, comprising: a front-end-of-line comprising a plurality of transistors, each transistor comprising a source region, a drain region, and a gate region, wherein the gate region is situated between the source region and the drain region and comprises a gate electrode; and a first buried interconnect situated in the front end of line and electrically connected to the gate region from below through a bottom contact portion of the gate electrode.
地址 Leuven BE