| 摘要 |
Embodiments of the present invention relate to the technical field of display and provide a glass frit, an optoelectronic packaging device and a packaging method thereof, and a display apparatus, which can reduce bubbles generated during high-temperature sintering of the glass frit, improve the surface evenness of the glass frit and increase the package area proportion after the glass frit is bound to a substrate of the device, without affecting the viscidity of the glass frit, thereby improving the mechanical strength of a packaged OLED panel. The glass frit comprises frit powder and an organic material. The organic material comprises an organic thickening agent. The glass frit further comprises an inorganic thickening agent formed by a clay mineral material. The embodiments of the present invention are applicable to the preparation of a glass frit and an optoelectronic packaging device and a display apparatus that comprise the glass frit. |
