发明名称 PRINTED-WIRING BOARD SUBSTRATE, PRINTED-WIRING BOARD, AND METHOD FOR PRODUCING PRINTED-WIRING BOARD SUBSTRATE
摘要 A printed-wiring board substrate according to one aspect of the present invention is provided with a base film and a metal layer disposed on at least one surface of the base film, and has a nitrogen abundance of 1-10 atomic% per unit area as determined on the basis of the peak area of N1s spectrum in XPS analysis performed on the base film surface that is exposed following the removal of the metal layer by etching using an acidic solution.
申请公布号 WO2017033713(A1) 申请公布日期 2017.03.02
申请号 WO2016JP73212 申请日期 2016.08.06
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;SUMITOMO ELECTRIC PRINTED CIRCUITS, INC.;SUMITOMO ELECTRIC FINE POLYMER, INC. 发明人 YAMANAKA, Yuichiro;OKA, Yoshio;KIYA, Satoshi;UCHITA, Yoshifumi;NAKABAYASHI, Makoto
分类号 H05K3/38 主分类号 H05K3/38
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