发明名称 CONDUCTOR CONNECTING STRUCTURE AND MOUNTING BOARD
摘要 A conductor connecting structure includes a mounting board, a target board, and an anisotropic conductive material. The mounting board includes a base material that includes first and second surfaces. The mounting board also includes a conductor layer formed on the first or second surface and a first dummy conductor layer formed at a corner of the second surface. The target board includes a mounting surface, a conductor layer, and a second dummy conductor layer. The anisotropic conductive material includes a polymeric material and electrically conductive particles dispersed in the polymeric material. The electrically conductive particles, when heated, aggregate so as to connect an end portion of the conductor layer of the mounting board and the conductor layer of the target board to each other and connect the first and second dummy conductor layers to each other.
申请公布号 US2017064828(A1) 申请公布日期 2017.03.02
申请号 US201615207676 申请日期 2016.07.12
申请人 FUJI XEROX CO., LTD. 发明人 OHTSU Shigemi
分类号 H05K1/14;H05K1/11;H05K1/09 主分类号 H05K1/14
代理机构 代理人
主权项 1. A conductor connecting structure comprising: a mounting board that includes a base material which is formed of an insulating material and which includes a first surface, anda second surface having a corner,a conductor layer that has an end portion and that is formed on the first surface or the second surface, anda first dummy conductor layer formed at the corner of the second surface; a target board that includes a mounting surface on which the mounting board is mounted,a conductor layer formed on the mounting surface, anda second dummy conductor layer formed on the mounting surface; and an anisotropic conductive material that includes a polymeric material, andelectrically conductive particles which are dispersed in the polymeric material and which, when the electrically conductive particles are heated, aggregate so as to connect the end portion of the conductor layer of the mounting board and the conductor layer of the target board to each other and connect the first dummy conductor layer and the second dummy conductor layer to each other.
地址 Tokyo JP