发明名称 SEMICONDUCTOR DEVICE HAVING ESD PROTECTION STRUCTURE
摘要 The present disclosure relates to a semiconductor device with an ESD protection structure. The semiconductor device includes a high-voltage power device 101, the ESD protection structure is a NMOS transistor 102, a drain of the NMOS transistor is shared by a source of the power device as a common-drain-source structure 107, substrate leading-out regions of the power device 101 and the NMOS transistor are coupled to the source 106 of the NMOS transistor as a ground leading-out. In the present disclosure, the drain of the NMOS transistor is shared by the source of the power device, so the increased area of the device with the ESD protection structure incorporated is small. In addition, the holding voltage at the source of the high-voltage power device is relatively low, which helps to protect the gate oxide and improve the source reliability.
申请公布号 US2017062405(A1) 申请公布日期 2017.03.02
申请号 US201515308574 申请日期 2015.05.04
申请人 CSMC TECHNOLOGIES FAB1 CO., LTD. 发明人 ZHANG Guangsheng;ZHANG Sen
分类号 H01L27/02;H01L23/535;H01L29/739 主分类号 H01L27/02
代理机构 代理人
主权项 1. A semiconductor device with an ESD protection structure, comprising a power device, wherein the ESD protection structure is a NMOS transistor, a drain of the NMOS transistor is shared by a source of the power device, substrate leading-out regions of the power device and the NMOS transistor are coupled to the source as a ground leading-out.
地址 Wuxi New District CN