METHOD FOR PRODUCING SEMICONDUCTOR COMPONENTS AND SEMICONDUCTOR COMPONENT

摘要

A method for producing a plurality of semiconductor components (1) is provided, comprising the following steps: a) providing a semiconductor layer sequence (2) having a first semiconductor layer (21), a second semiconductor layer (22) and an active region (25), said active region being arranged between the first semiconductor layer and the second semiconductor layer for generating and/or receiving radiation; b) forming a first connection layer (31) on the side of the second connection layer facing away from the first semiconductor layer; c) forming a plurality of cut-outs (29) through the semiconductor layer sequence; d) forming a conducting layer (4) in the cut-outs for establishing an electrically conductive connection between the first semiconductor layer and the first connection layer; and e) separating into the plurality of semiconductor components, wherein a semiconductor body (20) having at least one of the plurality of cut-outs arises from the semiconductor layer sequence for each semiconductor component and the at least one cut-out is completely surrounded by the semiconductor body in a top view of the semiconductor body. Furthermore, a semiconductor component is provided.

主权项

1. A method for producing a plurality of semiconductor components, comprising the steps of:
a) providing a semiconductor layer sequence having a first semiconductor layer, a second semiconductor layer and an active region, arranged between the first semiconductor layer and the second semiconductor layer provided for generating and/or receiving radiation; b) forming a first connection layer on the side of the second connection layer facing away from the first semiconductor layer; c) forming a plurality of cut-outs through the semiconductor layer sequence; d) forming a conducting layer in the cut-outs for establishing an electrically conductive connection between the first semiconductor layer and the first connection layer; and e) singulating into the plurality of semiconductor components, wherein a semiconductor body having at least one of the plurality of cut-outs arises from the semiconductor layer sequence for each semiconductor component and the at least one cut-out is completely surrounded by the semiconductor body in a top view of the semiconductor body.