SEMI-HERMETIC SEMICONDUCTOR PACKAGE

摘要

A method of assembling a semi-hermetic semiconductor package includes bonding a semiconductor die having bond pads to a top side of a base region of a package substrate having vertical side walls that are hollow which define an inner open volume (gap) having an adhesive or thermoplastic material therein. There are a plurality of metal terminals providing top terminal contacts on the top side of the base region and bottom terminal contacts on a bottom side or below the base region. The bond pads are coupled to the top terminal contacts. A lid is placed which provides a top for the semiconductor package, where the lid extends to vertically oriented end protrusions so that the protrusions are positioned within the adhesive or thermoplastic material to secure the protrusions within the adhesive or thermoplastic material to provide a seal for the semiconductor package.

主权项

1. A semiconductor packaged device (semiconductor package), comprising:
a package substrate comprising a dielectric material including a base region and vertical side walls that are hollow defining an inner open volume (gap); a plurality of metal terminals providing top terminal contacts on a top side of said base region and bottom terminal contacts on a bottom side of said base region; a semiconductor die having bond pads attached to said top side of said base region; wherein said bond pads are coupled to said top terminal contacts; an adhesive or thermoplastic material within said gap, and a lid providing a top for said semiconductor package extending to vertically oriented end protrusions (vertical protrusions) within said adhesive or thermoplastic material to provide a seal for said semiconductor package.