发明名称 WAFER PLATE AND MASK ARRANGEMENT FOR SUBSTRATE FABRICATION
摘要 A system for processing wafers in a vacuum processing chamber. Carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer. A transport mechanism configured to transport the plurality of carriers throughout the system. A plurality of wafer plates configured for supporting wafers. An attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier. Mask attached over front side of one of the plurality of opening in the carrier. Alignment stage supports wafer plate under the opening in the carrier. A camera positioned to simultaneously image the mask and the wafer.
申请公布号 US2017062258(A1) 申请公布日期 2017.03.02
申请号 US201615284241 申请日期 2016.10.03
申请人 Intevac, Inc. 发明人 Bluck Terry;Zanetto Aaron;Runstadler, JR. William Eugene;Pederson Terry
分类号 H01L21/68;H01L21/677;H01L21/683 主分类号 H01L21/68
代理机构 代理人
主权项 1. A system for processing wafers in a vacuum processing chamber, comprising: a plurality of carriers, each carrier comprising a frame having a plurality of openings, each opening configured to accommodate one wafer; a transport mechanism configured to transport the plurality of carriers throughout the system; a plurality of wafer plates, each wafer plate configured for supporting one wafer; an attachment mechanism for attaching a plurality of wafer plates to each of the carriers, wherein each of the wafer plates is attached to a corresponding position at an underside of a corresponding carrier, such that each of the wafers positioned on one of the wafer carriers is positioned within one of the plurality of opening in the carrier; a plurality of masks, each mask attached over front side of one of the plurality of opening in the carrier; an alignment stage, configured to support one of the wafer plates under one of the plurality of opening in the carrier, the alignment stage configured for motion in translation, rotation, and elevation; a camera positioned to image one of the plurality of masks and to image a wafer positioned on one of the wafer plates while the wafer plate is positioned on the alignment stage; a controller receiving images from the camera and sending correction signals to the alignment stage.
地址 Santa Clara CA US