主权项 |
1. A semiconductor device, comprising:
a semiconductor chip having a main surface including a first chip side, a second chip side opposite to the first chip side, a third chip side crossing to the first and second chip sides, a fourth chip side opposite to the third chip side and also crossing to the first and second chip sides, a first chip corner defined by the first and third chip sides, a second chip corner defined by the second and fourth chip sides, a third chip corner defined by the second and third chip sides, and a fourth chip corner defined by the first and fourth chip sides, wherein the semiconductor chip has a first data unit, a second data unit, a first data strobe, a second data strobe, a first clock unit, and a second clock unit, wherein, in plan view, the first data unit, the first data strobe and the first clock unit are arranged closer to the first chip side than the second chip side, and wherein, in plan view, the second data unit, the second data strobe and the second clock unit are arranged closer to the third chip side than the fourth chip side. |