| 摘要 |
A substrate integrated coaxial wave guide interconnection array structure, comprising at least one single-channel structure, and an inner conductor layer is arranged between a first outer conductor layer and a second outer conductor layer; a first dielectric layer is arranged between the first outer conductor layer and the inner conductor layer, and a second dielectric layer is arranged between the inner conductor layer and the second outer conductor layer; the first outer conductor layer, the second outer conductor layer and a metallized through-hole array form an outer conductor, and a plurality of single-channel structures form an array in a horizontal and vertical direction, and share the outer conductor; adjacent single-channel structures in the vertical direction share the same outer conductor layer; and adjacent single-channel structures in the horizontal direction share the same column of metallized through-hole array. A circuit board level/encapsulation level/chip level interconnection circuit has the advantages of a wide frequency band, low time delay crosstalk and good electromagnetic compatibility, is suitable for high-speed multi-channel parallel transmission of data larger than a gigabit, and has expandability transversely and longitudinally. |
