发明名称 ETCHING LIQUID COMPOSITION AND ETCHING METHOD
摘要 The purpose of the present invention is to provide: an etching liquid composition which allows for simultaneous etching of a titanium-based layer and a copper-based layer of a material, to be subjected to etching, having a laminate including the titanium-based layer and the copper-based layer, and which is capable of creating a fine line of a desired cross-sectional shape even when used continuously; and an etching method comprising using the etching liquid. To accomplish this purpose, the present invention provides: an etching liquid composition containing (A) 0.1-15.0 mass% of hydrogen peroxide, (B) 0.01-1.00 mass% of a fluoride ion source, (C) an organic sulfonic acid compound represented by general formula (I) or a salt thereof in an amount of 0.1-20.0 mass% in organic sulfonic acid equivalent, (D) 0.01-5.00 mass% of at least one type of compound selected from among azole compounds and compounds having a structure that has a 6-member heterocycle including at least one nitrogen atom and three double bonds, and (E) water; and an etching method comprising using the etching liquid composition. (In the formula, R represents an alkyl group having 1-4 carbon atoms, a hydroxyalkyl group having 1-4 carbon atoms, an aryl group having 6-10 carbon atoms, or a hydroxyaryl group having 6-10 carbon atoms.)
申请公布号 WO2017033915(A1) 申请公布日期 2017.03.02
申请号 WO2016JP74475 申请日期 2016.08.23
申请人 ADEKA CORPORATION 发明人 ISHIZAKI, Junro;OMIYA, Daisuke
分类号 H01L21/308;H01L21/306;H01L21/3205;H01L21/3213;H01L21/768;H01L23/532 主分类号 H01L21/308
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