| 发明名称 |
BONDED BODY, POWER MODULE SUBSTRATE, POWER MODULE AND METHOD FOR PRODUCING BONDED BODY |
| 摘要 |
There is provided a bonded body of the invention in which a ceramic member formed of a ceramic containing Al and a Cu member formed of Cu or a Cu alloy are bonded to each other, in which a bonding portion is formed between the ceramic member and the Cu member, an active metal compound region formed of a compound containing active metal is formed on the bonded portion on the ceramic member side, and an Al concentration of the bonding portion having a thickness range of 0.5 μm to 3 μm from one surface of the active metal compound region on the Cu member side towards the Cu member side is in a range of 0.5 at % to 15 at %. |
| 申请公布号 |
US2017062305(A1) |
申请公布日期 |
2017.03.02 |
| 申请号 |
US201515119547 |
申请日期 |
2015.01.30 |
| 申请人 |
MITSUBISHI MATERIALS CORPORATION |
发明人 |
Terasaki Nobuyuki;Nagatomo Yoshiyuki |
| 分类号 |
H01L23/373;H05K1/18;B23K35/30;H01L23/15;C04B37/02;B23K1/00 |
主分类号 |
H01L23/373 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A bonded body in which a ceramic member formed of a ceramic containing Al and a Cu member formed of Cu or a Cu alloy are bonded to each other,
wherein a bonding portion is formed between the ceramic member and the Cu member, an active metal compound region formed of a compound containing active metal is formed on the bonded portion on the ceramic member side, and an Al concentration of the bonding portion having a thickness range of 0.5 μm to 3 μm from one surface of the active metal compound region on the Cu member side towards the Cu member side is in a range of 0.5 at % to 15 at %. |
| 地址 |
Tokyo JP |
