ELECTRONIC DEVICE PROVIDED WITH AN INTEGRATED CONDUCTOR ELEMENT AND FABRICATION METHOD

摘要

An electronic device includes a support plate having a mounting face and an electrical connection network. An integrated circuit chip is mounted on the mounting face and linked to the electrical connection network. An en encapsulation block embeds the integrated circuit chip. An additional element made of an electrically conductive material is at least partly embedded within the encapsulation block. The additional conductive element has a main portion extending parallel to the support plate and has a secondary portion that is linked electrically to the integrated circuit chip. An opening is formed in the encapsulation block, and the secondary portion extends into that opening to make the electrical link. The additional conductive element may be an antenna.

主权项

1. An electronic device, comprising:
a support plate having a mounting face and including an electrical connection network; an integrated circuit chip mounted on said mounting face of the support plate and linked to said electrical connection network; an encapsulation block embedding the integrated circuit chip, said encapsulation block extending over the integrated circuit chip and around the integrated circuit chip on said mounting face of the support plate; and an additional conductive element made of an electrically conductive material and at least partly embedded in said encapsulation block, said additional conductive element having a main portion extending parallel to said support plate and having a secondary portion linked electrically to said integrated circuit chip.