发明名称 |
METHODS TO IMPROVE IN-FILM PARTICLE PERFORMANCE OF AMORPHOUS BORON-CARBON HARDMASK PROCESS IN PECVD SYSTEM |
摘要 |
Implementations of the present disclosure generally relate to the fabrication of integrated circuits. More particularly, the implementations described herein provide techniques for deposition of boron-containing amorphous carbon films on a substrate with reduced particle contamination. In one implementation, the method comprises flowing a hydrocarbon-containing gas mixture into a processing volume having a substrate positioned therein, flowing a boron-containing gas mixture into the processing volume, stabilizing the pressure in the processing volume for a predefined RF-on delay time period, generating an RF plasma in the processing volume after the predefined RF-on delay time period expires to deposit a boron-containing amorphous film on the substrate, exposing the processing volume of the process chamber to a dry cleaning process and depositing an amorphous boron season layer over at least one surface in the processing volume of the process chamber. |
申请公布号 |
US2017062218(A1) |
申请公布日期 |
2017.03.02 |
申请号 |
US201615203032 |
申请日期 |
2016.07.06 |
申请人 |
Applied Materials, Inc. |
发明人 |
DUAN Ziqing;LEE Kwangduk Douglas;KHAJA Abdul Aziz;BANSAL Amit Kumar;KIM Bok Hoen;KULSHRESHTHA Prashant Kumar |
分类号 |
H01L21/033;C23C16/455;C23C16/505 |
主分类号 |
H01L21/033 |
代理机构 |
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代理人 |
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主权项 |
1. A method, comprising:
flowing a hydrocarbon-containing gas mixture into a processing volume having a substrate positioned therein; flowing a boron-containing gas mixture into the processing volume; stabilizing the pressure in the processing volume for a predefined RF-on delay time period; generating an RF plasma in the processing volume after the predefined RF-on delay time period expires to deposit a boron-containing amorphous film on the substrate; exposing the processing volume to a dry cleaning process; and depositing an amorphous boron season layer over at least one surface in the processing volume. |
地址 |
Santa Clara CA US |