发明名称 |
SILVER-BISMUTH NON-CONTACT METALLIZATION PASTES FOR SILICON SOLAR CELLS |
摘要 |
Metallization pastes for use with semiconductor devices are disclosed. The pastes contain silver particles, low-melting-point base-metal particles, organic vehicle, and optional crystallizing agents. Specific formulations have been developed that produce stratified metal films that contain less silver than conventional pastes and that have high peel strengths. Such pastes can be used to make high contact resistance metallization layers on silicon. |
申请公布号 |
WO2017035102(A1) |
申请公布日期 |
2017.03.02 |
申请号 |
WO2016US48097 |
申请日期 |
2016.08.22 |
申请人 |
PLANT PV, INC |
发明人 |
HARDIN, Brian;CONNOR, Stephen;GROVES, James Randy;PETERS, Craig |
分类号 |
H01B1/22;H01L31/0224;H01L31/18 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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