| 发明名称 |
3DIC Package and Methods of Forming the Same |
| 摘要 |
A package includes a first molding material, a first device die molded in the molding material, a Through Via (TV) penetrating through the first molding material, and a redistribution line over the first molding material. The redistribution line is electrically connected to the TV. A second device die is over and bonded to the first device die through flip-chip bonding. A second molding material molds the second device die therein. |
| 申请公布号 |
US2017062391(A1) |
申请公布日期 |
2017.03.02 |
| 申请号 |
US201615350292 |
申请日期 |
2016.11.14 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Chen Kim Hong;Huang Szu-Po;Jeng Shin-Puu;Hung Wensen |
| 分类号 |
H01L25/065;H01L23/538;H01L25/00;H01L21/768;H01L21/56;H01L23/00;H01L23/31;H01L23/522 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A package comprising:
a first device die; a first encapsulating material encapsulating the first device die; an adhesive over and contacting the first encapsulating material; a second device die over and adhered to the first encapsulating material through the adhesive; a second encapsulating material encapsulating the second device die; and a first through-via penetrating through both the first encapsulating material and the second encapsulating material. |
| 地址 |
Hsin-Chu TW |
