发明名称 |
HYBRID CORRECTIVE PROCESSING SYSTEM AND METHOD |
摘要 |
A system and method for performing corrective processing of a workpiece is described. The system and method includes receiving a first set of parametric data from a first source that diagnostically relates to at least a first portion of a microelectronic workpiece, and receiving a second set of parametric data from a second source different than the first source that diagnostically relates to at least a second portion of the microelectronic workpiece. Thereafter, a corrective process is generated, and a target region of the microelectronic workpiece is processed by applying the corrective process to the target region using a combination of the first set of parametric data and the second set of parametric data. |
申请公布号 |
WO2017035030(A1) |
申请公布日期 |
2017.03.02 |
申请号 |
WO2016US47911 |
申请日期 |
2016.08.19 |
申请人 |
TEL EPION INC. |
发明人 |
LAROSE, Joshua;PFEIFER, Brian D.;LAGANA-GIZZO, Vincent;RUSSELL, Noel |
分类号 |
H01L21/66;H01L21/265 |
主分类号 |
H01L21/66 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|