发明名称 PRINTED CIRCUIT BOARD WITH INTEGRATED THIN FILM BATTERY
摘要 The present invention relates to, for example, printed circuit boards having a thin film battery or other electrochemical cell between or within its layer or layers. The present invention also relates to, for example, electrochemical cells within a layer stack of a printed circuit board.
申请公布号 US2017064836(A1) 申请公布日期 2017.03.02
申请号 US201615347705 申请日期 2016.11.09
申请人 Sapurast Research LLC 发明人 NEUDECKER BERND J.;KEATING Joseph A.
分类号 H05K1/18;H01M10/42;H01M10/04;H05K1/03 主分类号 H05K1/18
代理机构 代理人
主权项 1. A printed circuit board comprising: a printed circuit board (PCB) layer stack having a plurality of layers which include two outer electrically insulating layers, with conductor traces being formed on one or both of said two outer electrically insulating layers; wherein each of the two outer electrically insulating layers of the PCB layer stack comprises an insulator material disposed in an epoxy material; an electrochemical cell inserted in said PCB layer stack between said two outer electrically insulating layers of the PCB layer stack, wherein said electrochemical cell is embedded between said two outer electrically insulating layers of said PCB layer stack; a spacer between the two outer electrically insulating layers; and a gap of space located at an edge of said electrochemical cell, the gap of space defined by the spacer, said electrochemical cell and at least one of the two outer electrically insulating layers.
地址 Wilmington DE US