| 发明名称 |
LASER MARKING DEVICE AND METHOD THEREOF |
| 摘要 |
The present disclosure relates to a laser marking device and a method thereof. The laser marking device comprises a laser system, a wafer leveling system, a first imaging system and a mobile system: the wafer leveling system carries and levels a warped wafer to be processed; the mobile system underneath properly adjusts a position of the wafer; the first imaging system detects the wafer to recognize a product category and positioning status; the laser system underneath labels laser marks on the wafer; all wafers are marked in the cyclic process. |
| 申请公布号 |
US2017062252(A1) |
申请公布日期 |
2017.03.02 |
| 申请号 |
US201615051841 |
申请日期 |
2016.02.24 |
| 申请人 |
E&R Engineering Corp. |
发明人 |
WU Wen Ren;CHUNG Cho Chun |
| 分类号 |
H01L21/67;H01L21/268;B23K26/08;B23K26/362;B23K26/402;H01L23/544;H01L21/66 |
主分类号 |
H01L21/67 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A laser marking device, comprising a laser system (10), a mobile system (40) over the laser system (10), a wafer leveling system (20) over the mobile system (40), a first imaging system (30) over the wafer leveling system (20) and characterized in that: the wafer leveling system (20) carries and levels a warped wafer (50) to be processed; the mobile system (40) underneath properly adjusts a position of the wafer (50); the first imaging system (30) detects the wafer (50) to recognize a product category shown on the wafer (50) and positioning status; the laser system (10) underneath labels laser marks on the wafer (50). |
| 地址 |
Kaohsiung TW |
